The mechanical stresses formed are also predicted to be below the estimated yield strength, ensuring the structural integrity of the absorber. The absorption rates are observed to increase and shift due to bending deformations. The proposed absorber is found to be polarization-independent and showed high absorption rates up to 45° incident angle within the mentioned frequency range. The results reveal that wide-band absorption rates are achieved for the proposed absorber with a minimum rate of 91.17% at 400.3 THz. Concave and convex bending deformations are applied to the absorber within the mentioned frequency range. The study is conducted within the visible and ultraviolet frequency ranges (400 THz – 1200 THz). In this article, a novel wide-band Silicon-Carbon Nanotube (Si-CNT) based metamaterial absorber is proposed, and the effects of mechanical loading on electro-optical properties are investigated. Metamaterial absorbers are introduced in order to utilize them in harvesting solar energy. They are commonly used in energy, medical, and military fields. Metamaterials possess superior material properties that make them popular in various applications. Finite element modeling was used to explain why cells tend to crack more when loading the glass side of the modules as compared to the back side. We also describe an electroluminescence crack detection system which we developed to give quick and nondestructive feedback for imaging the cracked cells in a module. In this paper we describe a cell breakage strength tester that we constructed as a quick feedback and quality control tool for improving and monitoring the soldering process. In order to maintain good yields and module reliability as we shift our String Ribbon wafer thickness below 200 microns, Evergreen Solar has developed tools to aid in process, equipment, and materials optimization and has developed improved methods of crack detection at the module level. Cells can break during the process or later crack in the modules due to damage incurred during the process. The soldering of wires to the cells is one of the steps that becomes more challenging for thinner cells. Processes, materials, and handling equipment must adapt to maintain acceptable mechanical yields and module reliability. The need to reduce PV manufacturing costs combined with the present shortage of polysilicon feedstock are driving a steady reduction in wafer and cell thicknesses.
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